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• Kirsten hollow-wave
• Temperature profile
• Solder bath covering

jet wave - the Kirsten-Hollow Solder Wave 

The single, Kirsten hollow jet wave was selected because of its ability to provide hold-down forces and its ability to force molten solder on to every wettable surface.

The Italian physicist, Bernoulli, gave his name to the effect of flow rates of incompressible materials creating differing pressures on either side of the flow. In the case of Kirsten’s hollow jet wave, the atmospheric pressure above the wave is greater than the atmospheric pressure underneath. This results in a gentle, but consistent pressure on the components on the top side of the PCB so that they stay in position and do not rise up as is usually the case with other systems using Wörthmann or double wave.

The high flow rate of around 0.8 metres per second contributes to the special quality of the connections; it produces an optimal circulation and therefore a perfect covering of the wettable solder surfaces.

The high-speed jet wave also creates a mechanical scrubbing effect, ensuring that the solderable surfaces remain de-oxidised following the flux activity.

P	= total pressure
Pstat	= static pressure
Pdyn	= dynamic pressure
P	= Pdyn + Pstat	= constant
Pdyn	= 0,5 × C × spez. weight. × V2

With its universally patented electromagnetic soldering pump jet wave, the Kirsten Soldering AG has created an essential pre-requisite for a high-quality and energy-saving soldering system.

The pump, which operates according to the rotor/stator principle, does not contain a single moving part. In this way, the whole soldering pot construction can be kept to a very compact size. Therefore, the Kirsten jet wave soldering pump has a considerably smaller tin bath volume than conventional wave soldering machines, which means considerable less tin costs. This means substantially lower energy consumption. A considerably shorter wetting time for the individual soldering joints is yet another great advantage.

The heart of all wave soldering systems is the solder pump. Electromagnetic inductive power is powerful enough to accelerate the solder through the titanium nozzle plate at programmable and constant rates.

The advantages are that only the solder moves thereby offering almost no wear, and also the wave form is extremely even and is dependent only on the accuracy of the titanium nozzle plate with its patented solder channel arrangement to maintain consistent solder pressure.

The combination of magnetic fields and induced current provides the pump force which produces the wave at the height required by the programme. The electromagnetic linear pump motor is cooled by independent cooling fans that are triggered by temperature sensors built into the linear motor assembly.

 

 

 

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